Kategorie:Integrierte Schaltungen (IC)
Eingebettet
System auf Chip (Soc)
Produktstatus:Aktiv
Peripherie:DDR, DMA, PCIe
Primärattribute:Kern FPGA, 1M Logic Cells Versal™ AI
Reihe:Kern Versal™ AI
Paket:Tray
Mfr:AMD
Lieferanten-Gerätepaket:1369-BGA (35x35)
Zusammenhang:CANbus, EBI/EMI, Ethernet, i-² C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Betriebstemperatur:-40°C | 100°C (TJ)
Architektur:MPU, FPGA
Packung / Gehäuse:1369-BFBGA
Anzahl der E/Ausgänge:500
RAM Size:-
Geschwindigkeit:400MHz, 1GHz
Kern-Prozessor:Doppel- ARM® Cortex®-A72 MPCore™ mit CoreSight™, Doppel-ARM®Cortex™-R5F mit CoreSight™
Grelle Größe:-
Grundinformation
Zahlung und Versand AGB
Lagerbestand:Vorräte
Versandmethode:LCL, AIR, FCL, Express
Beschreibung:IC VERSAL AI-EDGE FPGA 1369BGA
Zahlungsbedingungen:L/C, D/A, D/P, T/T, Western Union, MoneyGram
Galerie
Die Zulassung wird von der Zulassungsbehörde erfolgen.
Produkt-Beschreibung
Dual ARM® Cortex®-A72 MPCoreTM mit CoreSightTM, Dual ARM®CortexTM-R5F mit CoreSightTM System On Chip (SOC) IC VersalTM AI Core VersalTM AI Core FPGA, 1M Logic Cells 400MHz, 1GHz 1369-BGA (35x35)
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